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BAT54S,215 Tech Specifications
Nexperia BAT54S,215 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 4 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Number of Pins | 3Pins | |
| Diode Element Material | SILICON | |
| Contact Materials | Copper | |
| Number of Elements | 2 Elements | |
| Power Dissipation (Max) | 0.25W | |
| Packaging | Tape & Reel (TR) | |
| Series | Automotive, AEC-Q101 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -55°C | |
| Color | Black | |
| HTS Code | 8541.10.00.70 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Current Rating | 500mA | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | BAT54S | |
| Pin Count | 3 | |
| Lead Pitch | 2.5mm | |
| Speed | Small Signal =< 200mA (Io), Any Speed | |
| Diode Type | Schottky | |
| Current - Reverse Leakage @ Vr | 2μA @ 25V | |
| Voltage - Forward (Vf) (Max) @ If | 800mV @ 100mA | |
| Forward Current | 200mA | |
| Operating Temperature - Junction | 150°C Max | |
| Output Current-Max | 0.2A | |
| Voltage - DC Reverse (Vr) (Max) | 30V | |
| Current - Average Rectified (Io) | 200mA DC | |
| Forward Voltage | 800mV | |
| Reverse Recovery Time | 5ns | |
| Diode Configuration | 1 Pair Series Connection | |
| Height | 3.1mm | |
| Length | 28mm | |
| Width | 30.5mm | |
| REACH SVHC | Unknown | |
| RoHS Status | ROHS3 Compliant |
BAT54S,215 Documents
Download datasheets and manufacturer documentation for BAT54S,215
- DatasheetsBAT54 Series Datasheet
- PCN Design/SpecificationWafer Fab Materials 23/Apr/2013 Resin Hardener 02/Jul/2013
- PCN PackagingLighter Reels 02/Jan/2014 Label Chg 12/Mar/2017
- RohsStatementNXP-Semiconductors-company-12.pdf
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