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BAT160S,115 Tech Specifications
Nexperia BAT160S,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 4 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-261-4, TO-261AA | |
| Number of Pins | 73Pins | |
| Diode Element Material | SILICON | |
| Number of Elements | 2 Elements | |
| Packaging | Tape & Reel (TR) | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 4Terminations | |
| ECCN Code | EAR99 | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -65°C | |
| Additional Feature | LOW SWITCHING LOSS | |
| HTS Code | 8541.10.00.70 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | BAT160S | |
| Pin Count | 4 | |
| Reference Standard | IEC-134 | |
| JESD-30 Code | R-PDSO-G4 | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Diode Type | Schottky | |
| Current - Reverse Leakage @ Vr | 350μA @ 60V | |
| Voltage - Forward (Vf) (Max) @ If | 650mV @ 1A | |
| Forward Current | 1A | |
| Max Reverse Leakage Current | 350μA | |
| Operating Temperature - Junction | 150°C Max | |
| Max Surge Current | 10A | |
| Output Current-Max | 1A | |
| Current - Average Rectified (Io) | 1A DC | |
| Forward Voltage | 850mV | |
| Max Reverse Voltage (DC) | 60V | |
| Average Rectified Current | 1A | |
| Peak Reverse Current | 350μA | |
| Max Repetitive Reverse Voltage (Vrrm) | 60V | |
| Peak Non-Repetitive Surge Current | 10A | |
| Diode Configuration | 1 Pair Series Connection | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BAT160S,115 Documents
Download datasheets and manufacturer documentation for BAT160S,115
- DatasheetsBAT160 Series
- PCN PackagingMult Dev Carrier Tape Chg 16/Feb/2020 Label Chg 12/Mar/2017
- PCN Assembly/OriginMult Dev Wafer Fab Rev 9/Jan/2019
- ReachStatementNXP-Semiconductors-company-13.pdf
- PCN Design/SpecificationMaterial Chg 22/Feb/2016 Wire Bond Chg 13/May/2016
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