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BAS16LD,315 Tech Specifications

Nexperia  BAS16LD,315 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 2-XDFN
Number of Pins 2Pins
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Series Automotive, AEC-Q101, BAS16
Published 2008
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Capacitance 1.5pF
Max Power Dissipation 250mW
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number BAS16L
Pin Count 2
Reference Standard AEC-Q101; IEC-60134
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 500nA @ 80V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 150mA
Forward Current 215mA
Operating Temperature - Junction 150°C Max
Max Surge Current 4A
Current - Average Rectified (Io) 215mA DC
Forward Voltage 1.25V
Max Reverse Voltage (DC) 100V
Average Rectified Current 215mA
Reverse Recovery Time 4 ns
Peak Reverse Current 500nA
Max Repetitive Reverse Voltage (Vrrm) 100V
Capacitance @ Vr, F 1.5pF @ 0V 1MHz
Peak Non-Repetitive Surge Current 4A
Reverse Voltage 100V
Max Forward Surge Current (Ifsm) 500mA
Recovery Time 4 ns
Max Junction Temperature (Tj) 150°C
Ambient Temperature Range High 150°C
Height 400μm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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