- Integrated Circuits (ICs)
- Embedded - Microprocessors
- MPC855TZQ50D4
Nexperia MPC855TZQ50D4 Embedded Microprocessors Tray
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MPC855TZQ50D4
Nexperia MPC855TZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| EU RoHS | Not Compliant | |
| ECCN (US) | 3A991.a.2 | |
| HTS | 8542.31.00.01 | |
| SVHC | Yes | |
| SVHC Exceeds Threshold | Yes | |
| Automotive | No | |
| PPAP | No | |
| Family Name | PowerQUICC MPC8xx Processor | |
| Instruction Set Architecture | RISC | |
| Number of CPU Cores | 1CPU Core | |
| Data Bus Width (bit) | 32 | |
| Instruction Cache Size | 4KB | |
| On-Chip Memory | 8KB/RAM | |
| Maximum Speed (MHz) | 50 | |
| Interface Type | I2C/SPI/UART | |
| UART | 1 | |
| USART | 0 | |
| Data Cache Size | 4KB | |
| Multiply Accumulate | No | |
| I2C | 1 | |
| I2S | 0 | |
| Ethernet Speed | 10Mbps/100Mbps | |
| Minimum Operating Supply Voltage (V) | 2|3.135 | |
| Typical Operating Supply Voltage (V) | 2.5|3.3 | |
| Maximum Operating Supply Voltage (V) | 3.465|3.6 | |
| Maximum Power Dissipation (mW) | 735 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 95 | |
| Mounting | Surface Mount | |
| Package Height | 1.82(Max) | |
| Package Width | 25 | |
| Package Length | 25 | |
| PCB changed | 357 | |
| Standard Package Name | BGA | |
| Supplier Package | BGA | |
| Lead Shape | Ball | |
| Packaging | Tray | |
| Part Status | Obsolete | |
| Pin Count | 357 | |
| Ethernet | 0 | |
| USB | 0 | |
| SPI | 1 | |
| CAN | 0 | |
| Device Core | MPC8xx |
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