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HEF4070BP Tech Specifications

Nexperia  HEF4070BP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Chassis Mount
Package / Case TNC In-Line Module
Surface Mount NO
Number of Pins 14Pins
Number of Terminals 14Terminals
Package Box
Mfr Anatech Electronics Inc.
Product Status Active
RoHS Compliant
Package Description DIP, DIP14,.3
Package Style IN-LINE
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP14,.3
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number HEF4070BP
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Philips Semiconductors
Part Life Cycle Code Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Risk Rank 4.5
Prop. 175 ns
Series -
Size / Dimension 5.512 L x 2.835 W (140.00mm x 72.00mm)
JESD-609 Code e4
Termination Through Hole
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature 70 °C
Min Operating Temperature -40 °C
Subcategory Gates
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Frequency 1.6GHz Center
JESD-30 Code R-PDIP-T14
Qualification Status Not Qualified
Operating Supply Voltage 15 V
Power Supplies 5/15 V
Temperature Grade INDUSTRIAL
Max Supply Voltage 15.5 V
Min Supply Voltage 4.5 V
Output Current 2.4 mA
Logic Function XOR
Number of Inputs 2Inputs
Bandwidth 50MHz
Filter Type Band Pass
Logic IC Type XOR GATE
Max I(ol) 0.00036 A
Number of Gates 4Gates
Insertion Loss 2dB
Schmitt Trigger NO
Ripple -
Height (Max) 1.250 (31.75mm)
REACH SVHC No SVHC
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