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BAS70-06W Tech Specifications

Nexperia  BAS70-06W technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Material synthetic polyolefin
Diode Element Material SILICON
Number of Terminals 3Terminals
Exterior Housing Material 2
Thickness after shrink 0.7 mm
Gross weight 19.40
Transport packaging size/quantity 102*20*20/500
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NEXPERIA
Package Description SC-70, SOT-323, 3 PIN
Date Of Intro 1995-01-12
Forward Voltage-Max (VF) 1 V
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Diameter of protected wire (cable) 8.3…15 mm
Pre-shrink diameter 17.0 mm
Post-shrink diameter 8.0 mm
Thickness before shrink 0.4 mm
Packaging in 1m cut lengths
JESD-609 Code e3
ECCN Code EAR99
Type Non-adhesive heat shrink tubing
Terminal Finish TIN
Color black
Additional Feature LOW LEAKAGE CURRENT
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Reference Standard IEC-60134
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Working voltage 600 V
Configuration COMMON ANODE, 2 ELEMENTS
Diode Type RECTIFIER DIODE
Output Current-Max 0.035 A
Number of Phases 1Phase
Operating temperature range -55…+125 °C
Rep Pk Reverse Voltage-Max 70 V
Non-rep Pk Forward Current-Max 0.1 A
Reverse Current-Max 10 μA
Shrink temperature +70…+120 °C
Reverse Test Voltage 70 V
2nd Connector Number of Positions Loaded GENERAL PURPOSE
Saturation Current 1
Shrink ratio 2 : 1
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BAS70-06W Documents

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