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MCMT18N330F250CT Tech Specifications

Multicomp  MCMT18N330F250CT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 0603
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Blue Anodized
Number of Terminals 2Terminals
Product Depth (mm) 0.8(mm)
Wire Form Not Required
Operating Temp Range -55C to 125C
Case Style Ceramic Chip
Product Diameter (mm) Not Required(mm)
Mounting Styles Surface Mount
Temp Coeff (Dielectric) C0G
Lead Diameter (nom) Not Required(mm)
Tolerance (+ or -) 1%
Rad Hardened No
Microwave Application NO
Seated Plane Height Not Required(mm)
MSL -
Qualification AEC-Q200
Capacitance Tolerance ± 1%
Series pushPIN™
Packaging Tape and Reel
Part Status Active
Type Top Mount
Capacitance 33PF(pF)
Technology STANDARD
Construction SMT Chip
Termination Style PAD
Failure Rate Not Required
Voltage 25VDC
Attachment Method Push Pin
Height Off Base (Height of Fin) 1.378 (35.00mm)
Thermal Resistance @ Forced Air Flow 3.32°C/W @ 100 LFM
Thermal Resistance @ Natural --
Power Dissipation @ Temperature Rise --
Product Length 1.6mm
Product Width 0.85mm
Product Length (mm) 1.6(mm)
Width 1.378 (35.00mm)
Length 1.378 (35.00mm)
Diameter --
Product Height (mm) 0.8(mm)
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