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2227MC-28-03-F1 Tech Specifications
Multicomp 2227MC-28-03-F1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Tin | |
| Body Orientation | Straight | |
| Number of Contact Rows | 2Contact Rows | |
| Row Spacing (mm) | 7.62(mm) | |
| Product Depth (mm) | 10.16(mm) | |
| Contact Resistance Max | 20(mohm) | |
| Operating Temp Range | -55C to 125C | |
| Termination Method | Solder | |
| Mounting Styles | Through Hole | |
| Contact Materials | Phosphor Bronze | |
| Grid Size | Not Required | |
| Rad Hardened | No | |
| Pitch (mm) | 2.54(mm) | |
| Pitch Spacing | 2.54mm | |
| Connector Type | DIP | |
| Type | IC SOCKET | |
| Gender | SKT | |
| Current Rating | 1(A) | |
| Number of Contacts | 28(POS)Contact | |
| Insulation Resistance | 1000(Mohm) | |
| Product Length (mm) | 35.56(mm) | |
| Product Height (mm) | 4.6(mm) |
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