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XPC850SRCZT66BU

Motorola Mobility LLC  XPC850SRCZT66BU technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Material Brass
Number of Terminals 256Terminals
Gross weight 1.35
Transport packaging size/quantity 28.5*21*19/5000
Thread M5
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description BGA, BGA256,16X16,50
Clock Frequency-Max 33 MHz
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
ECCN Code 3A991.A.2
Type Threaded bushing with hole series BN1035
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 256
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.35 mm
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Shaft diameter 5.5 mm
Length 23 mm
Width 23 mm

XPC850SRCZT66BU

Download datasheets and manufacturer documentation for   XPC850SRCZT66BU

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