M30624FGMFP Tech Specifications

Mitsubishi  M30624FGMFP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 100Terminals
Bundle Center to Mounting Center 131072
Clock Frequency-Max 10 MHz
Number of I/O Lines 88I/O Lines
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
Package Description PLASTIC, QFP-100
Part Package Code QFP
Ihs Manufacturer MITSUBISHI ELECTRIC CORP
Part Life Cycle Code Transferred
Rohs Code No
Supply Voltage-Nom 3 V
Supply Voltage-Min 2.7 V
Supply Voltage-Max 3.6 V
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature ALSO OPERATES IN THE RANGE OF 2.4 TO 2.7V AND 2.2 TO 2.4V SUPPLY @ LOWER FREQUENCY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 100
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
Temperature Grade OTHER
Speed 10 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 21.25 mA
Bit Size 16
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Seated Height-Max 3.05 mm
Address Bus Width 20
Coil Type 20480
On Chip Program ROM Width 8
CPU Family M16C
External Data Bus Width 16
ROM Programmability FLASH
Length 20 mm
Width 14 mm
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M30624FGMFP Documents

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