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A3P600-FG256 Tech Specifications
Microsemi A3P600-FG256 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-LBGA | |
| Number of Pins | 256Pins | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 400.011771mg | |
| Number of I/Os | 177I/Os | |
| Operating Temperature | 0°C~85°C TJ | |
| Packaging | Tray | |
| Series | ProASIC3 | |
| Published | 2009 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Max Operating Temperature | 70°C | |
| Min Operating Temperature | 0°C | |
| Voltage - Supply | 1.425V~1.575V | |
| Base Part Number | A3P600 | |
| Operating Supply Voltage | 1.5V | |
| Max Supply Voltage | 1.575V | |
| Min Supply Voltage | 1.425V | |
| RAM Size | 13.5kB | |
| Total RAM Bits | 110592 | |
| Number of Gates | 600000Gates | |
| Max Frequency | 231MHz | |
| Number of Registers | 13824Registers | |
| Height | 1.2mm | |
| Length | 17mm | |
| Width | 17mm | |
| Radiation Hardening | No | |
| RoHS Status | Non-RoHS Compliant |
A3P600-FG256 Documents
Download datasheets and manufacturer documentation for A3P600-FG256
- DatasheetsProASIC3 Flash Datasheet A3P600-FG256-Microsemi-datasheet-8325301.pdf FPGA,SoC Catalog
- PCN Design/SpecificationMult Dev Design Advisory 13/Oct/2017 Copper Wire Rev. C 24/Jun/2013
- PCN Assembly/OriginMult Dev Test Site 28/Feb/2019
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