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W3E32M72S-266BM

Microsemi  W3E32M72S-266BM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 5Chip per Modules
Chip Density (bit) 460.8M
Data Bus Width (bit) 72
Max. Access Time (ns) 0.75
Maximum Clock Rate (MHz) 266
Chip Package Type PBGA
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 2.7
Operating Current (mA) 2000
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Military
ECC Support Yes
Number of Chip Banks 4Chip Banks
CAS Latency 2.5
SPD EEPROM Support No
Supplier Package BGA
Mounting Surface Mount
Package Height 2.03(Max)
Package Length 32.1(Max)
Package Width 25.1(Max)
PCB changed 219
Pin Count 219
Organization 32Mx72
PLL No
Self Refresh Yes
RoHS Status Supplier Unconfirmed

W3E32M72S-266BM

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