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PC28F00AP33EF Tech Specifications

Micron Technology  PC28F00AP33EF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 64Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description TBGA, BGA64,8X8,40
Access Time-Max 95 ns
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Supply Voltage-Nom (Vsup) 3 V
JESD-609 Code e1
Pbfree Code Yes
ECCN Code EAR99
Type NOR TYPE
Terminal Finish TIN SILVER COPPER
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 64
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.3 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.031 mA
Organization 64MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.00024 A
Memory Density 1073741824 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 1K
Sector Size 64K
Page Size 16 words
Common Flash Interface YES
Length 10 mm
Width 8 mm
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PC28F00AP33EF Documents

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