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NAND98R3M0AZBB5E Tech Specifications

Micron Technology  NAND98R3M0AZBB5E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 107Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description FBGA, BGA107,10X14,32
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA107,10X14,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B107
Qualification Status Not Qualified
Temperature Grade OTHER
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SDRAM
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NAND98R3M0AZBB5E Documents

Download datasheets and manufacturer documentation for   NAND98R3M0AZBB5E

  • Datasheets
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