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- MT29F1G08ABBDAHC-IT
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MT29F1G08ABBDAHC-IT Tech Specifications
Micron Technology MT29F1G08ABBDAHC-IT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 63Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 10.50 X 13 MM, 1 MM HEIGHT, VFBGA-63 | |
| Number of Words | 134217728 wordsWord | |
| Number of Words Code | 128000000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| JESD-609 Code | e1 | |
| Pbfree Code | Yes | |
| ECCN Code | EAR99 | |
| Type | SLC NAND TYPE | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 63 | |
| JESD-30 Code | R-PBGA-B63 | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Operating Mode | ASYNCHRONOUS | |
| Organization | 128MX8 | |
| Seated Height-Max | 1 mm | |
| Memory Width | 8 | |
| Memory Density | 1073741824 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 1.8 V | |
| Length | 13 mm | |
| Width | 10.5 mm |
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