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MT8VDDT6464HIY-335F3

Micron Technology  MT8VDDT6464HIY-335F3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
Module DRAM Module
Module Density 512Mbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 512M
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 333
Chip Configuration 64Mx8
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 2.7
Operating Current (mA) 1400
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
ECC Support No
Number of Ranks SingleRank
CAS Latency 2.5
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
Package Height 31.9(Max)
Package Length 67.75(Max)
Package Width 3.8(Max)
PCB changed 200
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 200
Organization 64Mx64
Module Type 200SODIMM
RoHS Status Yes with exemptions

MT8VDDT6464HIY-335F3

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