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MT4LSDT864AG-10EG2

Micron Technology  MT4LSDT864AG-10EG2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 64Mbyte
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 128M
Data Bus Width (bit) 64
Max. Access Time (ns) 6
Maximum Clock Rate (MHz) 100
Chip Configuration 8Mx16
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 560
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 65
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks SingleRank
CAS Latency 2
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 25.53(Max)
Package Length 133.5(Max)
Package Width 3.18(Max)
PCB changed 168
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 168
Organization 8Mx64
Module Type 168UDIMM
RoHS Status RoHS non-compliant

MT4LSDT864AG-10EG2

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