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MF200K06F2-BP Tech Specifications

Micro Commercial Components  MF200K06F2-BP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Chassis Mount
Package / Case F2 Module
Surface Mount NO
Diode Element Material SILICON
Number of Elements 2 Elements
Operating Temperature (Max.) 150°C
Power Dissipation (Max) 690W
Packaging Bulk
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Applications ULTRA FAST SOFT RECOVERY
HTS Code 8541.10.00.80
Terminal Position UPPER
Terminal Form UNSPECIFIED
JESD-30 Code R-XUFM-X3
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 500μA @ 600V
Voltage - Forward (Vf) (Max) @ If 1.6V @ 200A
Case Connection ISOLATED
Operating Temperature - Junction -40°C~150°C
Output Current-Max 200A
Voltage - DC Reverse (Vr) (Max) 600V
Current - Average Rectified (Io) 200A
Number of Phases 1Phase
Reverse Recovery Time 140ns
Rep Pk Reverse Voltage-Max 600V
Non-rep Pk Forward Current-Max 2200A
Diode Configuration 1 Pair Series Connection
Reverse Current-Max 500μA
RoHS Status ROHS3 Compliant
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MF200K06F2-BP Documents

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