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ZL88602LDG1 Tech Specifications
Microchip ZL88602LDG1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | |
| Factory Lead Time | 24 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 64-VFQFN Exposed Pad | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tray | |
| Published | 2001 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 64Terminations | |
| Voltage - Supply | 3.135V~3.465V | |
| Terminal Position | QUAD | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.5mm | |
| JESD-30 Code | S-XQCC-N64 | |
| Function | Telecom Circuit | |
| Operating Supply Voltage | 3.3V | |
| Interface | PCM | |
| Number of Circuits | 1Circuit | |
| Max Supply Voltage (DC) | 3.465V | |
| Min Supply Voltage (DC) | 3.135V | |
| Hybrid | 2-4 CONVERSION | |
| Length | 9mm | |
| Width | 9mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
ZL88602LDG1 Documents
Download datasheets and manufacturer documentation for ZL88602LDG1
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN OtherMult Devices 06/May/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginFab Site 17/Dec/2019
- DatasheetsZL88601/602
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