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ZL30163GDG2
Microchip ZL30163GDG2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | |
| Factory Lead Time | 8 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 144-BGA | |
| Number of Pins | 144Pins | |
| Supplier Device Package | 144-LBGA (13x13) | |
| Frequency(Max) | 750MHz | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tray | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Base Part Number | ZL30163 | |
| Output | LVCMOS, LVPECL | |
| Number of Circuits | 1Circuit | |
| Input | Clock | |
| Ratio - Input:Output | 11:16 | |
| PLL | Yes | |
| Differential - Input:Output | Yes/Yes | |
| Main Purpose | Ethernet, Fibre Channel, SONET/SDH | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
ZL30163GDG2
Download datasheets and manufacturer documentation for ZL30163GDG2
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN OtherMult Devices 06/May/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- DatasheetsZL30163
- PCN Assembly/OriginBond Wire 08/Nov/2019
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