Microchip Technology VSC8584XKS-11 Telecom Interface ICs 1Circuit 2.5V BOTTOM
VSC8584XKS-11
1610-510-VSC8584XKS-11
256-BGA
RoHS Compliant
Function: Ethernet,Interface: GMII, SerDes, SPI, TBI,Number of Terminations: 256Terminations,Packaging: Tray
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VSC8584XKS-11 Tech Specifications
Microchip VSC8584XKS-11 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | |
| Factory Lead Time | 7 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-BGA | |
| Surface Mount | YES | |
| Packaging | Tray | |
| Published | 2013 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Number of Terminations | 256Terminations | |
| Max Operating Temperature | 125°C | |
| Min Operating Temperature | 0°C | |
| Voltage - Supply | 1V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Supply Voltage | 2.5V | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B256 | |
| Function | Ethernet | |
| Temperature Grade | OTHER | |
| Interface | GMII, SerDes, SPI, TBI | |
| Number of Circuits | 1Circuit | |
| RoHS Status | ROHS3 Compliant |
VSC8584XKS-11 Documents
Download datasheets and manufacturer documentation for VSC8584XKS-11
- DatasheetsVSC8584-11
- PCN PackagingLabel and Packing 01/Oct/2018 MBB/Label Chgs 16/Nov/2018
- PCN Design/SpecificationMarking Changes 27/Sep/2018 VCSYYY 25/Jun/2019
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