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USB3300-EZK-TR Tech Specifications
Microchip USB3300-EZK-TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 11 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Package / Case | 32-VFQFN Exposed Pad | |
| Number of Pins | 32Pins | |
| Weight | 188.609377mg | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2007 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 32Terminations | |
| Voltage - Supply | 3V~3.6V | |
| Terminal Position | QUAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.5mm | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | USB3300 | |
| Function | Controller | |
| Operating Supply Voltage | 3.3V | |
| Interface | ULPI | |
| Number of Ports | 1Port | |
| Data Rate | 480 Mbps | |
| Protocol | USB | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| USB | USB 2.0 | |
| Standards | USB 2.0, OTG | |
| Ambient Temperature Range High | 85°C | |
| Height | 1mm | |
| Length | 5mm | |
| Width | 5mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
USB3300-EZK-TR Documents
Download datasheets and manufacturer documentation for USB3300-EZK-TR
- DatasheetsUSB3300-EZK-TR-SMSC-datasheet-14189502.pdf USB3300-EZK-TR-Microchip-datasheet-82994720.pdf USB3300-EZK-TR-Microchip-datasheet-62330514.pdf USB3300
- PCN Design/SpecificationUSB3300 14/Jun/2016
- PCN PackagingMBB/Label Chgs 16/Nov/2018
- ConflictMineralStatementMicrochip-company-68.pdf
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