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LE58QL021BVC Tech Specifications
Microchip LE58QL021BVC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | |
| Factory Lead Time | 7 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 44-TQFP | |
| Number of Pins | 44Pins | |
| Supplier Device Package | 44-TQFP (10x10) | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tray | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Voltage - Supply | 3.3V | |
| Function | Subscriber Line Interface Concept (SLIC) | |
| Interface | PCM | |
| Number of Circuits | 4Circuits | |
| Max Supply Voltage | 5V | |
| Min Supply Voltage | 3.3V | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
LE58QL021BVC Documents
Download datasheets and manufacturer documentation for LE58QL021BVC
- DatasheetsLe58QL02/021/031
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
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