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COM20019I-DZD Tech Specifications
Microchip COM20019I-DZD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 2 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Package / Case | 28-LCC (J-Lead) | |
| Number of Pins | 28Pins | |
| Operating Temperature | 0°C~70°C | |
| Packaging | Tube | |
| Published | 2007 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 28Terminations | |
| Voltage - Supply | 4.5V~5.5V | |
| Terminal Position | QUAD | |
| Terminal Form | J BEND | |
| Supply Voltage | 3.3V | |
| Base Part Number | COM20019 | |
| Function | Controller | |
| Operating Supply Voltage | 5V | |
| Interface | Parallel | |
| Operating Supply Current | 20mA | |
| Max Supply Current | 20mA | |
| Clock Frequency | 20MHz | |
| Data Rate | 312.5 kbps | |
| Protocol | ARCNET | |
| Boundary Scan | NO | |
| Low Power Mode | NO | |
| Number of Transceivers | 1Transceiver | |
| RAM (words) | 2000 | |
| Standards | ARCNET 878.1 | |
| Height | 3.43mm | |
| Length | 11.58mm | |
| Width | 10.92mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
COM20019I-DZD Documents
Download datasheets and manufacturer documentation for COM20019I-DZD
- DatasheetsCOM20019I Data Brief
- PCN Assembly/OriginCOM20019I-DZD/COM20020I-DZD 01/Apr/2019
- PCN PackagingMBB/Label Chgs 16/Nov/2018
- ConflictMineralStatementMicrochip-company-68.pdf
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