Microchip 25LC640IPG Memory ICs
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25LC640IPG Tech Specifications
Microchip 25LC640IPG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 8Terminals | |
| Package Description | 0.300 INCH, PLASTIC, DIP-8 | |
| Package Style | IN-LINE | |
| Number of Words Code | 8000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 25LC640-I/PG | |
| Clock Frequency-Max (fCLK) | 2 MHz | |
| Number of Words | 8192 wordsWord | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Microchip Technology Inc | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Risk Rank | 5.22 | |
| Part Package Code | DIP | |
| JESD-609 Code | e3 | |
| Pbfree Code | Yes | |
| ECCN Code | EAR99 | |
| Terminal Finish | MATTE TIN | |
| HTS Code | 8542.32.00.51 | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 8 | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 8KX8 | |
| Seated Height-Max | 5.334 mm | |
| Memory Width | 8 | |
| Memory Density | 65536 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | EEPROM | |
| Serial Bus Type | SPI | |
| Write Cycle Time-Max (tWC) | 5 ms | |
| Width | 7.62 mm | |
| Length | 9.27 mm |
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