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DS33X11 Tech Specifications
Maxim Integrated DS33X11 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 14 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 144-LFBGA, CSPBGA | |
| Number of Pins | 144Pins | |
| Packaging | Tray | |
| Published | 2008 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Not For New Designs | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 144Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Applications | Data Transport | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 1.8V 2.5V 3.3V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 1.8V | |
| Terminal Pitch | 0.8mm | |
| Base Part Number | DS33X11 | |
| Pin Count | 144 | |
| Operating Supply Voltage | 3.3V | |
| Temperature Grade | INDUSTRIAL | |
| Interface | SPI Serial | |
| Max Supply Current | 300mA | |
| Data Rate | 1 Gbps | |
| Telecom IC Type | SUPPORT CIRCUIT | |
| Length | 10mm | |
| Height Seated (Max) | 1.5mm | |
| Width | 10mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
DS33X11 Documents
Download datasheets and manufacturer documentation for DS33X11
- DatasheetsDS33W11-DS33X82
- Environmental InformationMaterial Declaration DS33X11
- Application NotesDS33X162 Product Family FAQ
- ConflictMineralStatementMaxim-Integrated-company-65.pdf
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