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DS2482X-101 U Tech Specifications
Maxim Integrated DS2482X-101 U technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | 9-WFBGA, WLBGA | |
| Surface Mount | YES | |
| Number of Pins | 9Pins | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Bulk | |
| Published | 2012 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 9Terminations | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Voltage - Supply | 2.9V~5.5V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5mm | |
| Base Part Number | DS2482 | |
| Function | Bridge, 1-Wire® to I²C | |
| Operating Supply Voltage | 3.3V | |
| Power Supplies | 3.3/5V | |
| Interface | I2C | |
| Operating Supply Current | 750μA | |
| Protocol | 1-Wire® | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
DS2482X-101 U Documents
Download datasheets and manufacturer documentation for DS2482X-101 U
- DatasheetsDS2482(S)-100
- Application NotesUnderstanding and Configuring the DS2483 1-Wire? Master Choosing the Right 1-Wire? Master for Embedded Applications Determining the Recovery Time for Multiple-Slave 1-Wire? Networks Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications
- Environmental InformationMaterial Declaration DS2482X-101 U
- ConflictMineralStatementMaxim-Integrated-company-65.pdf
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