Original MAX2363EGM
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MAX2363EGM Tech Specifications
Maxim Integrated MAX2363EGM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 48Terminals | |
| Package Description | 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | UNSPECIFIED | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 2.8 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | MAX2363EGM | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Manufacturer | Rochester Electronics LLC | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Risk Rank | 5.66 | |
| Part Package Code | QFN | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| Terminal Finish | TIN LEAD | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 245 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 48 | |
| JESD-30 Code | S-XQCC-N48 | |
| Qualification Status | COMMERCIAL | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 1 mm | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Width | 7 mm | |
| Length | 7 mm |
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