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MICROSMD110F-2 Tech Specifications

Littelfuse  MICROSMD110F-2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 1210 (3225 Metric), Concave
Surface Mount YES
Terminal Shape ONE SURFACE
Operating Temperature -40°C~85°C
Packaging Cut Tape (CT)
Series PolySwitch®, microSMD
Published 2006
Size / Dimension 0.127Lx0.102W 3.22mmx2.58mm
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Number of Terminations 2Terminations
Type Polymeric
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Additional Feature MINIMUM RESISTANCE IS 0.07 OHMS
Packing Method TR, 7 INCH
Reach Compliance Code unknown
Rated Power Dissipation (P) 0.8W
Approval Agency CSA, TUV, UL
Operating Supply Voltage 6V
Terminal Placement DUAL ENDED
Rated (AC) Voltage (URac) 6V
Hold Current 1.1A
Thermistor Application TEMPERATURE SENSING
Voltage - Max 6V
Time to Trip 200ms
Resistance - Initial (Ri) (Min) 70mOhm
Resistance - Post Trip (R1) (Max) 210mOhm
Trip Current 2.2A
Height 480μm
Thickness (Max) 0.019 0.48mm
RoHS Status ROHS3 Compliant
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MICROSMD110F-2 Documents

Download datasheets and manufacturer documentation for   MICROSMD110F-2

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