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HEP.3F.330.XLNP Tech Specifications

LEMO  HEP.3F.330.XLNP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Flanges, Panel, Through Hole
Mounting Type Panel Mount, Through Hole
Mounting Feature Bulkhead - Front Side Nut
Shell Material Aluminum Alloy
Insert Material Polyetheretherketone (PEEK)
Body Material Aluminium
Contact Finish Mating Gold
Contact Materials Bronze
Operating Temperature -15°C~100°C
Packaging Bulk
Series 3F
Part Status Active
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 30Positions
Color Gray
Applications Aerospace
Gender Receptacle
Fastening Type Push-Pull
Orientation P
Shielding Shielded
Ingress Protection IP68 - Dust Tight, Waterproof
Current Rating 3.5A
Shell Finish Nickel
Shell Size - Insert 330
Features Potted
Contact Finish Thickness - Mating 59.0μin 1.50μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Ratings Dust Tight, IP68, Waterproof
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HEP.3F.330.XLNP Documents

Download datasheets and manufacturer documentation for   HEP.3F.330.XLNP

HEP.3F.330.XLNP brand manufacturers: LEMO, Twicea stock, HEP.3F.330.XLNP reference price.LEMO. HEP.3F.330.XLNP parameters, HEP.3F.330.XLNP Datasheet PDF and pin diagram description download.You can use the HEP.3F.330.XLNP Circular Connectors, DSP Datesheet PDF, find HEP.3F.330.XLNP pin diagram and circuit diagram and usage method of function,HEP.3F.330.XLNP electronics tutorials.You can download from the Twicea.