Lapp 2170229 Cable Assemblies pushPIN™
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2170229 Tech Specifications
Lapp 2170229 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Material | Aluminum | |
| Shape | Square, Fins | |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | |
| Material Finish | Blue Anodized | |
| Conductor Material | Tinned Copper | |
| Stranding element | No | |
| Flame retardant | No | |
| Permitted cable outer temperature after assembling without vibration | -40 - 85 | |
| Diameter conductor | 1.5 | |
| Material core insulation | Other | |
| Conductor surface | Tinned | |
| Colour outer sheath | Black | |
| Permitted cable outer temperature during assembling/handling | 0 - 0 | |
| Screen over stranding element | None | |
| Category | Other | |
| Halogen free according to IEC 60754-2 | No | |
| Core identification | Colour | |
| Nominal cross section conductor | 1.5 | |
| Screen over stranding | None | |
| Low smoke (according to EN 61034-2) | No | |
| Low smoke according to IEC 61034-2 | No | |
| Conductor category | Class 5 = flexible | |
| Voltage, Rating | 300V | |
| Jacket Material | EPDM Rubber | |
| Maximum Operating Temperature | +105°C | |
| Minimum Operating Temperature | -40°C | |
| Series | pushPIN™ | |
| Part Status | Active | |
| Type | Top Mount | |
| Wire Gauge | - | |
| Attachment Method | Push Pin | |
| Height Off Base (Height of Fin) | 0.590 (15.00mm) | |
| Thermal Resistance @ Forced Air Flow | 10.02°C/W @ 100 LFM | |
| Number of Cores | 2Cores | |
| Thermal Resistance @ Natural | -- | |
| Power Dissipation @ Temperature Rise | -- | |
| Minimum Bend Radius | 3 x D | |
| Width | 1.181 (30.00mm) | |
| Length | 1.181 (30.00mm) | |
| Diameter | -- |
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