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MR26V01G53L

LAPIS Semiconductor Co Ltd  MR26V01G53L technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 70Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD
Part Package Code SSOP
Package Description SSOP,
Access Time-Max 80 ns
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Supply Voltage-Nom (Vsup) 5 V
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 70
JESD-30 Code R-PDSO-G70
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.1 mA
Organization 1MX8
Seated Height-Max 3.05 mm
Memory Width 8
Memory Density 8388608 bit
Parallel/Serial PARALLEL
Memory IC Type MASK ROM
Length 28.6 mm
Width 12.7 mm
MR26V01G53L brand manufacturers: LAPIS Semiconductor Co Ltd, Twicea stock, MR26V01G53L reference price.LAPIS Semiconductor Co Ltd. MR26V01G53L parameters, MR26V01G53L Datasheet PDF and pin diagram description download.You can use the MR26V01G53L Memory, DSP Datesheet PDF, find MR26V01G53L pin diagram and circuit diagram and usage method of function,MR26V01G53L electronics tutorials.You can download from the Twicea.