BR93G86NUX-3ATTR

LAPIS  BR93G86NUX-3ATTR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Free Hanging (In-Line)
Package / Case 8-UFDFN Exposed Pad
Mounting Feature -
Shell Material Composite
Supplier Device Package VSON008X2030
Insert Material Thermoplastic
Backshell Material, Plating -
Voltage, Rating -
Package Bulk
Primary Material Composite
Base Product Number D38999/26JG
Mfr TE Connectivity Deutsch Connectors
Product Status Discontinued at Digi-Key
Contact Materials Copper Alloy
Contact Finish Mating Gold
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Other Names BR93G86NUX-3ATDKR
Memory Types Non-Volatile
Operating Temperature -65°C ~ 175°C
Series Military, MIL-DTL-38999 Series III, ACT
Packaging Original-Reel®
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Connector Type Plug, Male Pins
Number of Positions 79Positions
Color Olive Drab
Applications Aerospace, Military
Fastening Type Threaded
Current Rating (Amps) 5A
Technology EEPROM
Voltage - Supply 1.7 V ~ 5.5 V
Orientation B
Shielding Shielded
Ingress Protection Environment Resistant
Base Part Number BR93G86
Shell Finish Olive Drab Cadmium
Shell Size - Insert 21-35
Memory Size 16Kb (1K x 16)
Shell Size, MIL G
Clock Frequency 3MHz
Cable Opening -
Memory Format EEPROM
Memory Interface SPI
Write Cycle Time - Word, Page 5ms
Features -
Contact Finish Thickness - Mating 50.0µin (1.27µm)
Material Flammability Rating -
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