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60434 Tech Specifications
Lantronix 60434 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Lead, Tin | |
| Weight | 2.012816 mg | |
| Voltage, Rating | 75 V | |
| RoHS | Compliant | |
| Package | Bulk | |
| Mfr | Lantronix, Inc. | |
| Product Status | Active | |
| For Use With/Related Products | IDF10240 | |
| Factory Pack QuantityFactory Pack Quantity | 50 | |
| Manufacturer | Lantronix | |
| Brand | Lantronix | |
| For Use With | FOX3, SGX5150 | |
| Series | FOX3 | |
| Tolerance | 0.1 % | |
| Number of Terminations | 2Terminations | |
| Termination | SMD/SMT | |
| Temperature Coefficient | 25 ppm/°C | |
| Resistance | 130 Ω | |
| Max Operating Temperature | 125 °C | |
| Min Operating Temperature | -55 °C | |
| Composition | Thin Film | |
| Subcategory | Wireless & RF Modules | |
| Power Rating | 100 mW | |
| Max Power Dissipation | 100 mW | |
| Case Code (Metric) | 1608 | |
| Case Code (Imperial) | 0603 | |
| Accessory Type | Sensor | |
| Product Type | Bluetooth Modules | |
| Product | Accessory, Blue Coin ID | |
| Product Category | Bluetooth Modules - 802.15.1 | |
| Width | 838.2 µm | |
| Height | 558.8 µm | |
| Length | 1.6002 mm | |
| Radiation Hardening | No |
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