A10222-02

Laird  A10222-02 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Material Boron Nitride Filled
Shape Square
RoHS Details
Factory Pack QuantityFactory Pack Quantity 6
Tradename Tpli
Package Bulk
Mfr Laird Technologies - Thermal Materials
Product Status Active
Series Tpli 200
Packaging Bulk
Type Gap Filler Pad, Sheet
Color -
Usage -
Shelf Life 24 Months
Adhesive Adhesive - One Side
Storage/Refrigeration Temperature -
Shelf Life Start Date of Shipment
Backing, Carrier -
Outline 203.20mm x 203.20mm
Thermal Conductivity 6.0W/m-K
Product Thermally Conductive Gap Pad
Thermal Resistivity -
Thickness 0.0390 (0.991mm)
A10222-02 brand manufacturers: Laird Thermal Materials, Twicea stock, A10222-02 reference price.Laird Thermal Materials. A10222-02 parameters, A10222-02 Datasheet PDF and pin diagram description download.You can use the A10222-02 Thermal - Pads, Sheets, DSP Datesheet PDF, find A10222-02 pin diagram and circuit diagram and usage method of function,A10222-02 electronics tutorials.You can download from the Twicea.