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KVR667D2N5/1G Tech Specifications

Kingston  KVR667D2N5/1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8542.32.00.32
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 667
Chip Configuration 128Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Module Sides Single
ECC Support No
CAS Latency 5
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 18.3
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 128Mx64
PLL No
Self Refresh No
Module Type 240DIMM
RoHS Status Yes with exemptions
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KVR667D2N5/1G Documents

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