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KVR667D2E5/2GI Tech Specifications

Kingston  KVR667D2E5/2GI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 667
Chip Configuration 128Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Module Sides Double
ECC Support Yes
CAS Latency 5
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 256Mx72
PLL No
Self Refresh No
Module Type 240DIMM
RoHS Status Supplier Unconfirmed
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KVR667D2E5/2GI Documents

Download datasheets and manufacturer documentation for   KVR667D2E5/2GI

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