KVR26N19S6/4 Tech Specifications

Kingston  KVR26N19S6/4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 2666
Chip Configuration 512Mx16
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Single
ECC Support No
Number of Ranks SingleRank
CAS Latency 19
PC Type PC4-2666
SPD EEPROM Support Yes
Supplier Package DIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
Pins 288
Part Status Active
Pin Count 288
Voltage 1.2V
Speed 2666MHz
Organization 512Mx64
Memory Density 4
Capacity 4 GB
Self Refresh Yes
Module Type 288DIMM
RoHS Status RoHS Compliant
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KVR26N19S6/4 Documents

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