KVR24S17S6/4 Tech Specifications

Kingston  KVR24S17S6/4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 2400
Chip Configuration 512Mx16
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Single
ECC Support No
Number of Ranks SingleRank
CAS Latency 17
PCB changed 260
Package Width 2.45(Max)
Package Length 69.6
Package Height 30
Mounting Socket
Supplier Package SODIMM
SPD EEPROM Support Yes
PC Type PC4-2400
Part Status LTB
Pin Count 260
Organization 512Mx64
PLL No
Self Refresh Yes
Module Type 260SODIMM
RoHS Status Yes with exemptions
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KVR24S17S6/4 Documents

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