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KVR16LR11S8L/4 Tech Specifications

Kingston  KVR16LR11S8L/4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 800
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 11
PC Type PC3L-12800
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Package Height 18.75
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 512Mx72
PLL Yes
Self Refresh Yes
Module Type 240RDIMM
RoHS Status Supplier Unconfirmed
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KVR16LR11S8L/4 Documents

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