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KVR13N9S6/2

Kingston  KVR13N9S6/2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

HTS 8542.32.00.36
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1333
Chip Configuration 256Mx16
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Single
ECC Support No
Number of Ranks SingleRank
CAS Latency 9
PC Type PC3-10600
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 30
Package Length 133.35
PCB changed 240
Lead Shape No Lead
ECCN (US) EAR99
Part Status LTB
Pin Count 240
Organization 256Mx64
PLL No
Self Refresh Yes
Module Type 240DIMM
RoHS Status Yes with exemptions

KVR13N9S6/2

Download datasheets and manufacturer documentation for   KVR13N9S6/2

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