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KVR13LS9S6/2 Tech Specifications

Kingston  KVR13LS9S6/2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 667
Chip Configuration 256Mx16
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Single
ECC Support No
Number of Ranks SingleRank
CAS Latency 9
PC Type PC3L-10600
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 67.6
PCB changed 204
Lead Shape No Lead
RoHS Non-Compliant
Part Status LTB
Pin Count 204
Organization 256Mx64
PLL No
Self Refresh Yes
Module Type 204SODIMM
RoHS Status Yes with exemptions
Lead Free Lead Free
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KVR13LS9S6/2 Documents

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