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KSM26ED8/16ME

Kingston  KSM26ED8/16ME technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1629
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks DualRank
CAS Latency 19
Supplier Package DIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
ECCN (US) EAR99
Part Status Obsolete
Pin Count 288
Organization 2Gx72
Module Type 288DIMM
RoHS Status Yes with exemptions

KSM26ED8/16ME

Download datasheets and manufacturer documentation for   KSM26ED8/16ME

KSM26ED8/16ME brand manufacturers: Kingston Technology, Twicea stock, KSM26ED8/16ME reference price.Kingston Technology. KSM26ED8/16ME parameters, KSM26ED8/16ME Datasheet PDF and pin diagram description download.You can use the KSM26ED8/16ME Memory Cards, DSP Datesheet PDF, find KSM26ED8/16ME pin diagram and circuit diagram and usage method of function,KSM26ED8/16ME electronics tutorials.You can download from the Twicea.