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KSM24ES8/8ME

Kingston  KSM24ES8/8ME technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1305
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 17
Supplier Package DIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
Part Status Obsolete
Pin Count 288
Organization 1Gx72
Memory Density 8
Module Type 288DIMM
RoHS Status RoHS Compliant

KSM24ES8/8ME

Download datasheets and manufacturer documentation for   KSM24ES8/8ME

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