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HX426S15IB2/16

Kingston  HX426S15IB2/16 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support No
Number of Ranks DualRank
CAS Latency 15
SPD EEPROM Support No
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 69.6
PCB changed 260
Part Status Obsolete
Pin Count 260
Organization 2Gx64
PLL No
Module Type 260SODIMM
RoHS Status Supplier Unconfirmed

HX426S15IB2/16

Download datasheets and manufacturer documentation for   HX426S15IB2/16

HX426S15IB2/16 brand manufacturers: Kingston Technology, Twicea stock, HX426S15IB2/16 reference price.Kingston Technology. HX426S15IB2/16 parameters, HX426S15IB2/16 Datasheet PDF and pin diagram description download.You can use the HX426S15IB2/16 Memory Cards, DSP Datesheet PDF, find HX426S15IB2/16 pin diagram and circuit diagram and usage method of function,HX426S15IB2/16 electronics tutorials.You can download from the Twicea.