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- HTP ENG KIT 01
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HTP ENG KIT 01 Tech Specifications
KEMET HTP ENG KIT 01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 24 Weeks | |
| Mounting Type | Surface Mount, Through Hole | |
| Packages Included | 0402 ~ 2917 (1005 ~ 7343 Metric), Radial | |
| Voltage Rated | 10V~500V | |
| Packaging | Binder | |
| Published | 2017 | |
| Tolerance | ±2.5% ±5% ±10% | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Applications | Boardflex Sensitive, Downhole, General Purpose | |
| Quantity | 200 Pieces (Assorted Per Value) | |
| Kit Type | Ceramic, Tantalum | |
| Capacitance Range | 1500pF~220μF | |
| Features | Low ESL, High Voltage, High Temperature, Soft Termination | |
| RoHS Status | ROHS3 Compliant |
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