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CBR08C709CAGAC Tech Specifications

KEMET  CBR08C709CAGAC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 31 Weeks
Mount Surface Mount
Mounting Type Surface Mount, MLCC
Package / Case 0805 (2012 Metric)
Terminal Shape WRAPAROUND
Material Ceramic
Weight 5.499807mg
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series CBR-SMD RF C0G
Published 2016
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
Tolerance ±0.25pF
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Termination SMD/SMT
ECCN Code EAR99
Temperature Coefficient C0G NP0
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Applications RF, Microwave, High Frequency
HTS Code 8532.24.00.20
Capacitance 7pF
Voltage - Rated DC 250V
Packing Method TR, PUNCHED PAPER, 7 INCH
Case Code (Metric) 2012
Case Code (Imperial) 0805
Dielectric C0G
Temperature Characteristics Code C0G
Multilayer Yes
Features High Q, Low Loss, Ultra Low ESR
Height 950μm
Length 2mm
Width 1.25mm
Thickness (Max) 0.035 0.88mm
Thickness 889μm
RoHS Status ROHS3 Compliant
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CBR08C709CAGAC Documents

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