JW Miller TISP61060P Telecom Interface ICs DUAL
Min. : 1
Mult. : 1
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TISP61060P
Keystone Electronics Corp TISP61060P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 8Terminals | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | POWER INNOVATIONS LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 8 | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 5.08 mm | |
| Telecom IC Type | SURGE PROTECTION CIRCUIT | |
| Width | 7.62 mm |
TISP61060P
Download datasheets and manufacturer documentation for TISP61060P
- DatasheetsPOWID00001-3-7.pdf
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