MM60-52B1-B1-R850 Tech Specifications

JAE  MM60-52B1-B1-R850 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Housing Material Plastic
Material - Insulation Thermoplastic
Contact Materials Copper Alloy
Operating Temperature -40°C~85°C
Packaging Cut Tape (CT)
Series MM60
Published 2005
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 52Positions
Number of Rows 2Rows
Gender Female
Pitch 0.031 0.80mm
Orientation Horizontal
Current Rating 500mA
Contact Finish Gold
Contact Resistance 55mOhm
Card Type PCI Express Mini Card
Read Out Dual
Row Spacing 800 μm
Features Board Guide
Height 3.9mm
Length 25mm
Width 10mm
Contact Finish Thickness 3.94μin 0.10μm
Card Thickness 0.039 1.00mm
REACH SVHC Unknown
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
View Similar

MM60-52B1-B1-R850 Documents

Download datasheets and manufacturer documentation for   MM60-52B1-B1-R850

MM60-52B1-B1-R850 brand manufacturers: JAE Electronics, Twicea stock, MM60-52B1-B1-R850 reference price.JAE Electronics. MM60-52B1-B1-R850 parameters, MM60-52B1-B1-R850 Datasheet PDF and pin diagram description download.You can use the MM60-52B1-B1-R850 Card Edge Connectors - Edgeboard Connectors, DSP Datesheet PDF, find MM60-52B1-B1-R850 pin diagram and circuit diagram and usage method of function,MM60-52B1-B1-R850 electronics tutorials.You can download from the Twicea.