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MM60-52B1-B1-R850 Tech Specifications
JAE MM60-52B1-B1-R850 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 14 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, Right Angle | |
| Housing Material | Plastic | |
| Material - Insulation | Thermoplastic | |
| Contact Materials | Copper Alloy | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Cut Tape (CT) | |
| Series | MM60 | |
| Published | 2005 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | Socket | |
| Number of Positions | 52Positions | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Pitch | 0.031 0.80mm | |
| Orientation | Horizontal | |
| Current Rating | 500mA | |
| Contact Finish | Gold | |
| Contact Resistance | 55mOhm | |
| Card Type | PCI Express Mini Card | |
| Read Out | Dual | |
| Row Spacing | 800 μm | |
| Features | Board Guide | |
| Height | 3.9mm | |
| Length | 25mm | |
| Width | 10mm | |
| Contact Finish Thickness | 3.94μin 0.10μm | |
| Card Thickness | 0.039 1.00mm | |
| REACH SVHC | Unknown | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 |
MM60-52B1-B1-R850 Documents
Download datasheets and manufacturer documentation for MM60-52B1-B1-R850
- DatasheetsCard Conn, SIM, CF, DIMM, PCIe MM60-52B1-B1 Drawing
- Other Related DocumentsCard Selection Guide
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