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HS9-6664RH-8 Tech Specifications

Intersil  HS9-6664RH-8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Pins 28Pins
Number of Terminals 28Terminals
RoHS Compliant
Package Description DFP, FL28,.5
Package Style FLATPACK
Number of Words Code 8000Words Codes
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Equivalence Code FL28,.5
Operating Temperature-Min -55 °C
Access Time-Max 65 ns
Operating Temperature-Max 125 °C
Rohs Code No
Manufacturer Part Number HS9-6664RH-8
Number of Words 8192 wordsWord
Supply Voltage-Nom (Vsup) 5 V
Package Code DFP
Package Shape RECTANGULAR
Manufacturer Harris Semiconductor
Part Life Cycle Code Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR
Risk Rank 5.78
Usage Level Military grade
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 125 °C
Min Operating Temperature -55 °C
Additional Feature RADIATION-HARDENED PROM
HTS Code 8542.32.00.71
Subcategory OTP ROMs
Technology CMOS
Terminal Position DUAL
Terminal Form FLAT
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code R-CDFP-F28
Qualification Status Not Qualified
Operating Supply Voltage 5 V
Power Supplies 5 V
Temperature Grade MILITARY
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.015 mA
Organization 8KX8
Output Characteristics 3-STATE
Memory Width 8
Density 64 kb
Standby Current-Max 0.0005 A
Memory Density 65536 bit
Screening Level 38535Q/M;38534H;883B
Parallel/Serial PARALLEL
Memory IC Type OTP ROM
Radiation Hardening Yes
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